- SpaceX (Bastrop, TX)
- Principal IC Packaging Test Engineer, Silicon Technology (Starlink) Bastrop, TX Apply SpaceX was founded under the belief that a future where humanity is ... make this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is… more
- SpaceX (Bastrop, TX)
- Principal IC Packaging Engineer,...reliable internet to 4M+ users worldwide. We design, build, test , and operate all parts of the system - ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER, SILICON...SMT assembly experience + OSAT (outsource semiconductor assembly and test ) experience a plus ITAR REQUIREMENTS: + To conform… more
- BAE Systems (Manassas, VA)
- …of missions. We are seeking a highly skilled and experienced radiation assurance and packaging engineer to join our team in Manassas, VA. The ideal candidate should ... board design, package design, high frequency digital technologies, mixed signal IC technologies, and electrical testing of RF and digital circuits.… more
- Skyworks (Andover, MA)
- …including PVT simulations + Work with cross-functional teams from Foundry engineering, packaging , and test to realize advance prototypes. + Support development ... Sr. Principal Electrical Engineer - Analog Design Lead Apply...the needs of Connectivity products and define applicable analog test vehicles for development + Engage in all aspects… more
- Cadence Design Systems, Inc. (San Jose, CA)
- …your favorite tablet. Responsibilities: * Design and develop advanced automated design flows for 3D- IC , IC Packaging and PCB applications* Design and develop ... incorporate machine learning elements into product features* Plan, design, develop, test and maintain key software enhancements, take responsibility for quality and… more
- Qualcomm (San Diego, CA)
- …systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging , test systems, FPGA, and/or DSP systems. * ... This individual independently plans, performs the moderately-defined responsibility for the test solutions, Bring up, debug, validation and qualification of new… more
- Qualcomm (San Diego, CA)
- …with Automated Test Equipment: Advantest or Teradyne is a plus. ** Principal Duties and Responsibilities:** * Applies Hardware knowledge and experience to plan, ... systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging , test systems, FPGA, and/or DSP systems. *… more
- BAE Systems (Merrimack, NH)
- …test , production test , and qualification + Deep understanding of the full IC development process, including IC packaging approaches and wafer, die, ... partnerships and collaborate across a broad innovation ecosystem that includes DoD/ IC /OGA labs and research teams, universities, small businesses, and venture… more