- Micron Technology, Inc. (Boise, ID)
- …technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging, you will be ... faster than ever. **Department Intro:** The Advanced Packaging Technology Development ( APTD ) department at Micron Technology is at the forefront of innovation,… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. **Department Intro:** The Advanced Packaging Technology Development ( APTD ) department at Micron Technology is at the forefront of innovation, ... Memory (HBM) and Flip Chip. + Detailed understanding of thermal compression bonding process for chip-on-wafer and wafer-to-wafer hybrid bonding process and the… more