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- …Compressor Bond/Ultrasonic Bond + Ability to perform Wirebond operation and Strain Relief operation + Epoxy/Adhesive/ Strain Relief ... assembly work. + Strong communication skills. + Strong skills in tester operations and PC application usage. **Technical Skills:** + High Precision Build Equipment… more
- CTG (San Jose, CA)
- …bonder)/Thermal Compressor Bond/Ultrasonic Bond + Ability to perform Wirebond operation and Strain Relief operation . + This role would need to be a ... + Strong communication skills. + Strong skills in tester operations and PC application usage. **Technical Skills:** + High...Engineer tech to work with their dev team. + Epoxy/Adhesive/ Strain Relief Application + High/Low Power Inspection… more
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