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Job Description

At Boeing, we innovate and collaborate to make the world a better place. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Boeing Research & Technology (BR&T) is current looking for a **Microelectronics Packaging** **Engineer (Associate, Mid-Level or Lead** ) to join the team based in **Huntington Beach, CA.**

We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enable the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future!

\#TheFutureIsBuiltHere #ChangeTheWorld

BR&T Microelectronics Technology (MET) team, performs microelectronics technology development and design for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms.

The Boeing Research and Technology team is seeking an innovative Microelectronics Packaging Engineer (Associate, Mid-Level, Senior) to join our Microelectronics Technology team in Huntington Beach, CA.

This packaging engineer will have a strong background in the current state-of-the-art for advanced microelectronics and semiconductor packaging. The successful candidate will participate in and lead the innovation and development of novel 2.5D / 3DHI advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufacturability and reliability. Designs are implemented with state-of-the-art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED using external wafer fabrication teams. Our team has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. Join us and put your passion, determination, and skill into working and building the future!

Position Responsibilities:

+ Conducts advanced packaging analysis based on system requirements, development of architectural approaches, and detailed specifications

+ Resolves complex issues on critical programs related to advanced packaging approaches, requirements, specifications and design

+ Designing and optimizing layout for advanced substrates of HDI IC substrate, Silicon, or LTCC substrates, considering electrical, thermal, and mechanical requirements.

+ Collaborate in multi-functional discussions for package architecture and technology roadmap (partner with Silicon IC team)

+ Cross-functional interface with IC design, materials, SI/PI, thermal, systems, and production teams to optimize package solutions on cost, performance, manufacturability, and reliability

+ Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp

+ Optimize package pinouts by evaluating system-level trade-offs - Conduct package routing, placement, stack-up, reference plane, and power distribution activities

+ Conduct design feasibility studies to assess package design goals encompassing size, cost, and performance

+ Develop symbols and CAD library databases using Cadence APD or Mentor Xpedition tools

+ Works under minimal direction

Basic Qualifications (Required Skills/Experience):

+ Ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret clearance Post-Start is required

+ Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science

+ Experience with EDA tool flow and vendor supports including but are not limited to chiplets floor-planning, interposer design, SiP optimization, physical simulation, and chiplets assembly

+ Hands-on experience with package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools

Preferred Qualifications (Desired Skills/Experience):

+ Active security clearance

+ 5+ years of related work experience or an equivalent combination of education and internship experience

+ Experience with 3DIC development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical and thermal considerations

+ Experience with TSV, 2D/2.5D and 3D package connection

+ Hands-on expertise of advanced and new assembly processes for flipchip, wirebond, and MCM packages

+ SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model

+ Substrate manufacturing process, structure, design rules and material property

+ Solid understanding of high-speed interfaces, including DDR, PCIe, NAND, etc

+ Consistent track record to drive package selection through feasibility studies and drive chip Floor planning and bump assignment

+ Familiar with package design reviews and familiarity with CAM350/Valor or Calibre and CAD

+ Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance)

+ Familiar with Cadence Concept HDL for schematic review, experience in schematic capture and system integration

+ Experience in advanced node IC layouts such as 22nm, 16nm, 7nm, 5nm or below

+ Experience in layout of sensitive RF blocks such as low noise amplifiers, voltage controlled oscillators and mixers

+ Understanding of layout considerations for device matching, coupling and noise isolation

+ Knowledge of advanced substrate manufacturing/process

+ Knowledge of failure analysis techniques on advanced node silicon products

+ Conceptual knowledge of package cost structure

+ Knowledge of GD&T and be able to read/comprehend mechanical drawings

+ Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers

+ Computer proficiency and ability to use and navigate the internet and various computer software programs (e.g. Microsoft Office Suite)

+ Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources

Pay & Benefits:

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations.

Summary pay range for Associate: $85,850.00 - $116,150.00

Summary pay range for Mid-Level: $104,550.00 - $141,450.00

Summary pay range for Lead: $126,650.00 - $171,350.00

Applications for this position will be accepted until **May. 28, 2025**

**Export Control Requirements:** This position must meet export control compliance requirements. To meet export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.15 is required. “U.S. Person” includes U.S. Citizen, lawful permanent resident, refugee, or asylee.

**Export Control Details:** US based job, US Person required

Education

Bachelor's Degree or Equivalent Required

Relocation

This position offers relocation based on candidate eligibility.

Security Clearance

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret/SCI Clearance Post-Start is required.

Visa Sponsorship

Employer will not sponsor applicants for employment visa status.

Shift

This position is for 1st shift

Equal Opportunity Employer:

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.