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Who We Are

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.

What We Offer

Salary:

$216,000.00 - $302,500.00

Location:

Santa Clara,CA

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits (https://hrportal.ehr.com/applied/) .

You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.

A 3D IC (Integrated Circuit) Package Designer is responsible for the development and design of advanced packaging solutions for integrated circuits. This role typically involves the following key responsibilities and requirements:

Key Responsibilities

+ Design Development: Create and develop 3D packaging designs for ICs, ensuring optimal performance, thermal management, and reliability.

+ Simulation and Analysis: Utilize simulation tools to analyze the electrical, thermal, and mechanical performance of package designs.

+ Collaboration: Work closely with cross-functional teams, including chip designers, system engineers, and manufacturing teams, to ensure package designs meet specifications and integration requirements.

+ Prototyping: Oversee the prototyping process to validate designs through testing and iterations.

+ Documentation: Prepare detailed documentation for design specifications, test plans, and design reviews.

+ Industry Standards: Stay updated on industry standards, materials, and technologies relevant to 3D IC packaging.

+ Problem Solving: Identify and address design-related issues and challenges throughout the development process.

+ Project Management: Manage timelines and deliverables for packaging design projects, ensuring timely completion.

Required Qualifications:

+ Education: Master’s degree in Electrical Engineering, Physics, or a related field.

+ Experience: Proven experience in IC packaging design, with expertise in 3D packaging technologies and methodologies.

+ Software Proficiency: Proficiency in CAD software and simulation tools (e.g. SPICE, Sigrity, ANSYS-EM, Cadence Allegro, IBIS, Scripting).

+ Knowledge of Materials: Understanding of materials used in semiconductor packaging and their properties.

+ Attention to Detail: Strong analytical skills and attention to detail to ensure high-quality and reliable designs.

+ Team Player: Excellent communication and collaboration skills to work effectively in a team environment.

Preferred Qualifications:

+ Certifications: Relevant certifications in IC design or packaging may be an advantage.

+ Advanced Tools Experience: Familiarity with advanced tools and methodologies in 3D IC design and packaging.

+ Research and Development: Experience in R&D projects related to new packaging technologies or applications.

_Successful candidates must be eligible to lawfully receive export-controlled information, without the need for the company to seek a license. Furthermore, since the role entails work on a US government funded project, the successful candidate must also be able to meet the government’s requirements for eligibility to participate in the project, without the need for the company to seek an exception/extraordinary approval. The government’s requirements include certain restrictions on nationality and association/affiliation with entities deemed to be of concern._

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site (https://www.appliedmaterials.com/us/en/careers.html) accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.