• IC Package Designer

    Data Device Corporation (Bohemia, NY)
    IC Package Designer Department: Engineer Location:Bohemia, NY For more than 60 years, Data Device Corporation (DDC) has been recognized as a world leader in the ... design and manufacture of high-reliability Connectivity, Power, and Control...with advanced packaging technologies (eg, 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded,… more
    Data Device Corporation (09/03/25)
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