- Data Device Corporation (Bohemia, NY)
- IC Package Designer Department: Engineer Location:Bohemia, NY For more than 60 years, Data Device Corporation (DDC) has been recognized as a world leader in the ... design and manufacture of high-reliability Connectivity, Power, and Control...with advanced packaging technologies (eg, 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded,… more