• IC Package Designer

    Data Device Corporation (Bohemia, NY)
    …engineering team. The ideal candidate will have in-depth knowledge of substrate design , package layout , signal integrity, and manufacturing constraints. This ... Material science or related field. + Experience: 8+ years of experience in IC package design and development + Tool Skills: Experience with package design … more
    Data Device Corporation (09/03/25)
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  • Hardware and Systems Development Interns - 2026…

    IBM (Poughkeepsie, NY)
    …- SolidWorks, CFD, FEM, design -for-manufacturing, reliability testing. *Electrical & Logic Design - PCB/ IC layout (Cadence, Allegro), digital logic, ... and logic designs using CAD, EDA, and simulation tools. *Participate in PCB layout , power and signal integrity, circuit design , firmware development, and system… more
    IBM (11/16/25)
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  • Quantum Hardware Design Engineer

    IBM (Yorktown Heights, NY)
    …components and full designs **Required technical and professional expertise** * RF/microwave/ IC design tooling (eg, Cadence Virtuoso/Innovus, Synopsys Custom ... includes deep involvement at all levels of design tapeouts using custom design tools, including block-level and chip-level layout . Applicants are expected to… more
    IBM (11/14/25)
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  • Design Intern - Advanced Integrated…

    IBM (Yorktown Heights, NY)
    …and verification of the designed circuits and sub-systems * Support physical design /synthesis and post- layout verification * Document design concept, ... also involve the analysis of measured data from existing/prior ICs * Peform design and/or synthesis of digital and/or mixed-signal circuit building blocks to meet a… more
    IBM (10/21/25)
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  • 3D Heterogeneous Integration Design…

    Global Foundries (Malta, NY)
    …(geometry rules, electrical rules, etc.) that must be followed for an integrated circuit ( IC ) design to be manufacturable. + Advanced packaging liaison to the DM ... specification covering: design rules , library device ( TSV) layouts, layout vs schematic( LVS) requirements , device model terminals. + Develop expertise in… more
    Global Foundries (11/09/25)
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  • Electronics Package Design Engineer

    MetaOption, LLC (Ronkonkoma, NY)
    Electronics Package Design Engineer Primary Skills - package layout , signal integrity, flip chip, bga, ceramic, multi-chip modules, electronics packaging, system ... Engineering, Materials Science, or related field. * 8+ years in IC /electronic packaging design . * Proficiency with Cadence Allegro or equivalent tools. *… more
    MetaOption, LLC (10/25/25)
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  • Sr. Space Planning Specialist

    University of Rochester (Rochester, NY)
    …+ Prepares program documentation. + Prepares reports, recommendations, planning programs, layout schematics or interior design for approval by client]user ... facilities master Ian in su ort of the strat ic and r rammatic lans of the or anization....meeting the required mission. + Consults with architects, contractors, design /construction project managers and the like regarding such things… more
    University of Rochester (09/15/25)
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