- Micron Technology, Inc. (Boise, ID)
- …Staff Design Engineer to join our TSV Packaging team. High-performance memory devices like HBM , RDIMM/LRDIMM and CAMM modules, graphics GDDR packages and ... up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory ( HBM ) and Flip Chip. + Detailed understanding of thermal… more
- Micron Technology, Inc. (Boise, ID)
- … will be directly involved in developing new and derivative advanced memory ( HBM ) packaging technologies, driving Micron's Thermal advantage by designing ... power maps, die and package architecture, and Si BEOL design rules, finding efficient package structure and materials to...and advanced electronics packaging technologies such as High Bandwidth Memory ( HBM ), wafer to wafer (W2W), Chip-On-Wafer… more
- Micron Technology, Inc. (Boise, ID)
- …demonstrated block/project leadership, including mentoring and schedule management. + DRAM/LPDDR/ HBM memory product layout background; familiarity with ... , analog, or standard cell circuits, ensuring predictable, on‑time delivery of memory designs. **Responsibilities:** + Design and Development: Create layout… more
- Micron Technology, Inc. (Boise, ID)
- …for** **_all_** **.** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into ... to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson,… more