• MTS Packaging Integration Engineer

    Global Foundries (Malta, NY)
    …hybrid bonding and wafer-to-wafer hybrid bonding. Essential Responsibilities: + Defines process integration specifications for assembly flow of co-packaged ... couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with...project management and data analysis + Identify and resolve process integration issues and related problems +… more
    Global Foundries (01/08/26)
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  • Sr Photonics Product Packaging Engineer

    Global Foundries (Malta, NY)
    …hybrid bonding and wafer-to-wafer hybrid bonding. Essential Responsibilities: + Defines process integration specifications for assembly flow of co-packaged ... couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with...project management and data analysis + Identify and resolve process integration issues and related problems +… more
    Global Foundries (01/08/26)
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