• Principal Design Engineer , TSV…

    Micron Technology, Inc. (Boise, ID)
    …leadership in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices ... collaborate, partner, and implement. **Responsibilities:** + Stay up-to-date on semiconductor and advanced electronics packaging technologies like High… more
    Micron Technology, Inc. (12/10/25)
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  • Sr Wet Process Engineer , Advanced…

    Micron Technology, Inc. (Boise, ID)
    …world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
    Micron Technology, Inc. (12/09/25)
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  • Principal Thermal Simulation Engineer…

    Micron Technology, Inc. (Boise, ID)
    …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (12/10/25)
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  • Principal RDA/Metrology Engineer , APTD

    Micron Technology, Inc. (Boise, ID)
    …Electrical Engineering, or related field + 5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + ... in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for...**Preferred Experience:** + 8+ years working directly with Advanced Packaging metrology or RDA development in the semiconductor… more
    Micron Technology, Inc. (12/06/25)
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  • Staff Engineer , Advanced Modeling & AI…

    Micron Technology, Inc. (Boise, ID)
    …physics based Advanced Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The team plays a ... intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor process technology development, package development, design, and early… more
    Micron Technology, Inc. (12/12/25)
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  • Staff Process Integration Engineer , APTD

    Micron Technology, Inc. (Boise, ID)
    …learn, communicate and advance faster than ever. **Department intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated… more
    Micron Technology, Inc. (01/10/26)
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  • Senior Process Engineer , APTD

    Micron Technology, Inc. (Boise, ID)
    …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (12/06/25)
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  • MTS Process Integration Engineer , APTD

    Micron Technology, Inc. (Boise, ID)
    …Micron's leadership in the industry. **Position Overview:** As a Process Integration Engineer for Advanced Packaging , you will own the end-to-end integration ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (01/07/26)
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  • Staff Process Engineer , APTD Bonding

    Micron Technology, Inc. (Boise, ID)
    …Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (12/10/25)
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  • Principal Process Engineer , APTD Bonding

    Micron Technology, Inc. (Boise, ID)
    …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (11/12/25)
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