• Advanced Packaging Process Engineer

    Micron Technology, Inc. (Boise, ID)
    …that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for starting up, developing ... + Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor... Packaging As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
    Micron Technology, Inc. (09/24/25)
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  • Staff Engineer , Advanced Modeling & AI…

    Micron Technology, Inc. (Boise, ID)
    …physics based Advanced Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The team plays a ... intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor process technology development, package development, design, and early… more
    Micron Technology, Inc. (09/13/25)
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  • Process Quality Engineer /Sr. Process…

    Micron Technology, Inc. (Boise, ID)
    …Integration teams, supporting technology development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be ... we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM...half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform… more
    Micron Technology, Inc. (11/05/25)
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  • Principal Process Engineer , APTD Bonding

    Micron Technology, Inc. (Boise, ID)
    …Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily responsible for ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
    Micron Technology, Inc. (11/12/25)
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  • Sr. Workforce Development Engineer , TPG

    Micron Technology, Inc. (Boise, ID)
    …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson,… more
    Micron Technology, Inc. (10/17/25)
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  • DMTS Process Integration Engineer , APTD

    Micron Technology, Inc. (Boise, ID)
    …innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and ... molding the future of technology! **Position Overview:** As a Process Integration Engineer at Micron, you will define technology requirements, build program plans,… more
    Micron Technology, Inc. (09/26/25)
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  • Staff Signal Integrity Engineer

    Micron Technology, Inc. (Boise, ID)
    …areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of future ... improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal integrity… more
    Micron Technology, Inc. (11/20/25)
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  • DMTS Product Architect

    Micron Technology, Inc. (Boise, ID)
    …to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep ... memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging ,...bonuses and equity. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more
    Micron Technology, Inc. (11/21/25)
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