- Micron Technology, Inc. (Boise, ID)
- …Experience in performing fracture simulations for IC packages. + Experience in semiconductor process simulation like wafer-to-wafer bonding process , thermal ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
- Micron Technology, Inc. (Boise, ID)
- …Physics, or other related field + 0-6 years of direct experience working as a process development engineer in an R&D environment + Knowledge of Advanced Package ... the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …and statistical analysis tools + Interest in advanced packaging and interconnect development As a world leader in the semiconductor industry, Micron is ... such as KT (Kepner-Tregoe) + Define and implement Design of Experiments (DoE) for process development + Present findings and collaborate across sites and teams +… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at ... stacking, HBM memory integration, and hybrid bonding. You'll lead new advanced packaging technology development , technology transfer, design DOEs, analyze yield… more
- Micron Technology, Inc. (Boise, ID)
- …learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at ... nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Process Integration Engineer for Advanced Packaging , you will own the… more
- Micron Technology, Inc. (Boise, ID)
- …5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + Strong knowledge of RDA tooling capability, ... out sensitivity and gauge evaluation/optimization to implement changes at process step + Lead and participate in yield improvement...directly with Advanced Packaging metrology or RDA development in the semiconductor industry + Data… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron... process capability + Collaborating with Equipment teams, Process Development and Process Integration… more
- Micron Technology, Inc. (Boise, ID)
- …Virtual Metrology, AI, process control, yield improvement, quality control, semiconductor process engineering, image analytics, or related semiconductor ... analyzing and extracting valuable insights from large datasets related to semiconductor manufacturing, process optimization, and quality control. You'll… more
- Micron Technology, Inc. (Boise, ID)
- …your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at… more
- Micron Technology, Inc. (Boise, ID)
- …of intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor process technology development , package development ... Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The...5 years of experience working with a variety of semiconductor design & process datasets. Proficient in… more