- Oracle (Boise, ID)
- …or validating, testing in the areas of integrated circuits, semiconductor process technologies, and semiconductor packaging , resulting in innovative ... ensuring thorough quality assurance reviews with Engineering and oversight of service development needs for equipment retirement and refresh projects. + **Day 2… more
- Micron Technology, Inc. (Boise, ID)
- …implementation of new product concepts. Working closely with Product and Business Development Managers you will ensure that each technical decision is aligned with ... memory architectures, system memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging , and 3D … more
- Micron Technology, Inc. (Boise, ID)
- …subject areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of ... products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development . We handle the interconnect and signaling exploration and development… more