- Micron Technology, Inc. (Boise, ID)
- …Experience in performing fracture simulations for IC packages. + Experience in semiconductor process simulation like wafer-to-wafer bonding process , thermal ... Influence, Collaborate, Partner and Implement. **Responsibilities:** + Stay up-to-date on semiconductor and advanced electronics packaging technologies like High… more
- Micron Technology, Inc. (Boise, ID)
- …that is molding the future of technology! **Position Overview:** As an Advanced Packaging Engineer you will be primarily responsible for starting up, developing ... Physics or Mechanical Engineering + Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor industry, Micron is… more
- Micron Technology, Inc. (Boise, ID)
- …Engineering, Physics, or other related technical fields + 2+ years of semiconductor process or equipment engineering experience + Fundamental understanding of ... the future of technology! **Position Overview:** As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you… more
- Micron Technology, Inc. (Boise, ID)
- …Summary:** We are looking for a proactive and technically skilled APTD Shift Lead Engineer to lead a team of engineers and technicians in a fast-paced ... semiconductor manufacturing environment. This role is pivotal in driving...environment. This role is pivotal in driving equipment reliability, process stability, and team performance across shifts. You'll collaborate… more
- Micron Technology, Inc. (Boise, ID)
- …nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily ... field or equivalent experience + 8 years of validated experience in Process Integration/Development or Package Integration within the semiconductor industry +… more
- Micron Technology, Inc. (Boise, ID)
- …or other related technical fields or relevant experience + Experience in semiconductor process engineering and packaging with fundamental understanding ... processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D...molding the future of technology! **Position Overview:** As a Process Engineer in the APTD team, you… more
- Micron Technology, Inc. (Boise, ID)
- … Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, build ... has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries and scientists, developing… more
- Micron Technology, Inc. (Boise, ID)
- …the future of technology! **Position Overview:** As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, ... innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and… more
- Micron Technology, Inc. (Boise, ID)
- …faster than ever. Micron Technology is searching for its next Product Pathfinding Engineer on the High Bandwidth Memory (HBM) technology team! In this role, you ... and 3D solutions, including HBM, from an electrical and packaging standpoint. Product Engineers at Micron are the key...across multiple sites. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing… more