- Micron Technology, Inc. (Boise, ID)
- …Experience in performing fracture simulations for IC packages. + Experience in semiconductor process simulation like wafer-to-wafer bonding process , thermal ... leadership in the industry. **Position Overview:** We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices… more
- Eliassen Group (Boise, ID)
- …programs **Experience Requirements:** + 10+ years in semiconductor packaging including experience in package assembly process , package engineering, ... **RF Packaging Engineer ** **Anywhere** **Type:** Contract **Category:**... packaging documentation including SOWs, package drawings, and process flows + Design and layout of semiconductor… more
- Micron Technology, Inc. (Boise, ID)
- …nodes to maintain Micron's leadership in the industry. As a Senior Wet Process Engineer , you will be primarily responsible for developing and optimizing ... learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is...+ 0-6 years of direct experience working as a process development engineer in an R&D environment… more
- Micron Technology, Inc. (Boise, ID)
- …Electrical Engineering, or related field + 5+ years of experience in Advanced Packaging Technology metrology or RDA development for semiconductor products + ... in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for...**Preferred Experience:** + 8+ years working directly with Advanced Packaging metrology or RDA development in the semiconductor… more
- Micron Technology, Inc. (Boise, ID)
- …who is optimistic and responsible. **Job Responsibilities:** + Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High ... learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), Defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is...the future of technology! **Position Overview:** As a Senior Process Engineer in the APTD team, you… more
- Micron Technology, Inc. (Boise, ID)
- …development across Planar DRAM, Advanced DRAM, and Advanced Packaging TD. As a Process Quality Engineer , you will be recognized as a domain expert in Fab ... team and contribute to the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE) team operates at the critical interface… more
- Micron Technology, Inc. (Boise, ID)
- …Process Control (SPC), defect analysis and data analysis + Experience in semiconductor process engineering and packaging with fundamental understanding of ... technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Process Engineer on the APTD Bonding team, you will be responsible… more
- Micron Technology, Inc. (Boise, ID)
- …nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging , you will be primarily ... field or equivalent experience + 8+ years of validated experience in Process Integration/Development or Package Integration within the semiconductor industry +… more
- Micron Technology, Inc. (Boise, ID)
- …of intelligent, advanced physics or ML-powered modeling solutions that enhance semiconductor process technology development, package development, design, and ... Modeling and AI solutions to tackle complex challenges in semiconductor component, packaging , and systems engineering. The...5 years of experience working with a variety of semiconductor design & process datasets. Proficient in… more