• Sr. Workforce Development Engineer , TPG

    Micron Technology, Inc. (Boise, ID)
    …experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging . + Position level will be determined based on education and experience. ... to learn, communicate and advance faster than ever. **Workforce Development Engineer ** **Technology & Products Group (TPG)** **Location: Boise, ID or Richardson,… more
    Micron Technology, Inc. (10/17/25)
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  • Global Quality IC Package Design/Development…

    Micron Technology, Inc. (Boise, ID)
    …Overview:** As a GQ Package Design/Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology Inc., you will be responsible for the quality ... Engineering, Physics, or related field. + 7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R). + Experience with… more
    Micron Technology, Inc. (12/18/25)
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  • Principal Signal Integrity Engineer

    Micron Technology, Inc. (Boise, ID)
    …communicate and advance faster than ever. **Principal** **Signal Integrity** ** Engineer ** **- Interface Pathfinding** Micron's Interface Pathfinding team serves as ... opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3-5 year outlook, and to… more
    Micron Technology, Inc. (12/09/25)
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  • Staff Signal Integrity Engineer

    Micron Technology, Inc. (Boise, ID)
    …areas and organizations (eg, Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)! **Responsibilities:** + Development of future ... improvement in performance scaling, signaling, and sophisticated packaging + Leverage modeling and simulation methodology to improve accuracy to signal integrity… more
    Micron Technology, Inc. (11/20/25)
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  • DMTS Product Architect

    Micron Technology, Inc. (Boise, ID)
    …to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep ... memory hierarchy, and compute system architectures. + Exposure to packaging technologies such as TSV, stacked packaging ,...salary range for your preferred location during the hiring process . Please note that the compensation details listed in… more
    Micron Technology, Inc. (11/21/25)
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