- Global Foundries (Malta, NY)
- …. This role will entail 3D heterogeneous integration (3DHI) development including wafer -to- wafer and die-to- wafer bonding. Essential Responsibilities: + Lead ... with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous...time & costs. + Generate IP related to novel wafer integration & packaging technology. + Work and collaborate… more
- Global Foundries (Malta, NY)
- …engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes wafer to wafer hybrid bonding, die to wafer hybrid ... bonding, TSV/TOV and interposer development. Essential Responsibilities include: + Performing DOEs utilizing internal semiconductor tooling and at external partners. + Analyzing engineering data from experiments and optimizations + Modeling of processes +… more
- Global Foundries (Malta, NY)
- …compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Essential Responsibilities: + Hands on GF technical subject matter expert for SiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts +… more
- Global Foundries (Malta, NY)
- …converters and 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding . ... Responsibilities: + Defines p ackaging solutions to meet customer product specifications and cost , yield, and reliability targets. + Drive technology and product qualifications from inception through release to production. + Assesses product characterization… more
- Global Foundries (Malta, NY)
- …with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Responsibilities: + Defines process integration materials specifications for assembly flow of co-packaged optics modules driving toward s assembly manufacturability cost , yield, and reliability targets. + Establishment of manufacturing driven design rule s… more
- Global Foundries (Malta, NY)
- …with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Responsibilities: + Drives high engagement and trust within their team and between teams to deliver beyond expectations. + Delivers results providing training and cross training to ensure highly team continuity and effectiveness. + Leads team to d efine… more
- Global Foundries (Malta, NY)
- …integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer - to - wafer bonding, die - to - wafer ... bonding , TSV/TOV and interposer development. Essential Responsibilities: + P ublish D esign M anual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers. + DM… more
- Cree (Marcy, NY)
- …As a Manufacturing Material Handler, you will be responsible for clean room wafer logistics which includes preparing bare semiconductor wafers to be manufactured and ... up to 15%, as well as overtime and bonus eligibility. The Day-to-Day: Semiconductor wafer unpacking, and preparation, to enable the wafers to be used, or reused, in… more
- Cree (Marcy, NY)
- …As a Manufacturing Material Handler, you will be responsible for clean room wafer logistics which includes preparing bare semiconductor wafers to be manufactured and ... up to 15%, as well as overtime and bonus eligibility . The Day-to-Day: Semiconductor wafer unpacking, and preparation, to enable the wafers to be used, or reused, in… more
- The Research Foundation for SUNY at the University at Albany (Albany, NY)
- …microelectronics fabrication, metrology, and electrical characterization facilities within CNSE's 200mm wafer scale "Innovation Lab" as well as the Albany NanoTech ... Complex's state-of-the-art 300mm wafer scale fabrication facilities / cleanrooms. The post doc...Qualifications: + Electrical engineering PhD. + Demonstrated knowledge with wafer scale and chip-scale electrical device and circuit testing… more