- NY CREATES (Albany, NY)
- …+ The Integration Development Eng Tech- TECH III will be involved in wafer -lot characterization, metrology, inspection, and data review, with daily reporting of such ... + Integration Development Eng Tech- TECH III will address wafer -lots on hold and work with engineering staff to...forward thinking for contributing to process solutions for test wafer flows and equipment evaluation. + Excellent written and… more
- Cree (Marcy, NY)
- …local outreach. Here's the Gist: As a Manufacturing Technician, you'll oversee wafer production from inception to completion, working with engineers and stakeholders ... PVD, metrology, and others. Perform logistic tasks such as wafer unpacking, releasing to process, and packing. Maintain a.... Monitor and evaluate operating data to ensure optimized wafer movement in the fabricator . This Job is… more
- Cree (Marcy, NY)
- …As a Manufacturing Material Handler, you will be responsible for clean room wafer logistics which includes preparing bare semiconductor wafers to be manufactured and ... up to 5%, as well as overtime and bonus eligibility. The Day-to-Day: Semiconductor wafer unpacking, and preparation, to enable the wafers to be used, or reused, in… more
- Global Foundries (Malta, NY)
- …engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes wafer to wafer hybrid bonding, die to wafer hybrid ... bonding, TSV/TOV and interposer development. Essential Responsibilities include: + Performing DOEs utilizing internal semiconductor tooling and at external partners. + Analyzing engineering data from experiments and optimizations + Modeling of processes +… more
- Global Foundries (Malta, NY)
- …compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Essential Responsibilities: + Hands on GF technical subject matter expert for SiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts +… more
- Global Foundries (Malta, NY)
- …converters and 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding . ... Responsibilities: + Defines p ackaging solutions to meet customer product specifications and cost , yield, and reliability targets. + Drive technology and product qualifications from inception through release to production. + Assesses product characterization… more
- Global Foundries (Malta, NY)
- …with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Responsibilities: + Defines process integration materials specifications for assembly flow of co-packaged optics modules driving toward s assembly manufacturability cost , yield, and reliability targets. + Establishment of manufacturing driven design rule s… more
- Global Foundries (Malta, NY)
- …with 3D electrical interconnect solutions including Copper RX, Copper uPillar , chip-on- wafer hybrid bonding and wafer -to- wafer hybrid bonding. ... Responsibilities: + Drives high engagement and trust within their team and between teams to deliver beyond expectations. + Delivers results providing training and cross training to ensure highly team continuity and effectiveness. + Leads team to d efine… more
- Global Foundries (Malta, NY)
- …integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer - to - wafer bonding, die - to - wafer ... bonding , TSV/TOV and interposer development. Essential Responsibilities: + P ublish D esign M anual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers. + DM… more
- Cree (Marcy, NY)
- …As a Manufacturing Material Handler, you will be responsible for clean room wafer logistics which includes preparing bare semiconductor wafers to be manufactured and ... up to 15%, as well as overtime and bonus eligibility . The Day-to-Day: Semiconductor wafer unpacking, and preparation, to enable the wafers to be used, or reused, in… more