• Principal Process Engineer…

    Micron Technology, Inc. (Boise, ID)
    …new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Die Bonding, you will be primarily responsible ... 8D or SPC/FDC methodology. **Responsibilities:** + Develop, diagnose, and resolve various die bonding process technologies + Coordinate and execute process… more
    Micron Technology, Inc. (10/11/25)
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  • Principal Process Engineer…

    Micron Technology, Inc. (Boise, ID)
    …technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Principal Process Engineer in Advanced Packaging, you will be ... optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management… more
    Micron Technology, Inc. (08/13/25)
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  • Advanced Modeling Principal Engineer

    Micron Technology, Inc. (Boise, ID)
    …Modeling Engineer to pioneer technology advancements! As an Advanced Modeling Principal Engineer at Micron, you will continuously uplevel your skills and ... Develop digital twins for fab technology co-optimization covering wafer, die , and package level models across tech nodes. +...is a huge plus. + Previous experience as a Process or PI engineer is an asset.… more
    Micron Technology, Inc. (09/30/25)
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  • Principal Thermal Simulation…

    Micron Technology, Inc. (Boise, ID)
    …nodes, maintaining Micron's leadership in the industry. The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced ... position, you will be influencing the Product power maps, die and package architecture, and Si BEOL design rules,...packaging development that are related to design, material and process interactions. In this position you will collaborate with… more
    Micron Technology, Inc. (10/08/25)
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